Engineering Kit built with NVIDIA Jetson AGX Orin Module D315AO-64G

• 120-pin highspeed connector for MIPI SerDes cameras, such as GMSL2/FPD-link III/V-by-One HS, to deploy in AMR application
• 1x GbE & 1x 10G RJ-45 ethernet for dozens of IP cameras streaming simultaneously in smart security application
• 10GigE Vision camera connector for smart inspection.
• 1x PCIe slot for multi-function expansion.
• 1x M.2. E key for Wi-Fi 6E, 1x mPCIe for 4G & 5G with adapter card, and 1x M.2. M key for SSD and capture
• Operating temperature: -25°C ~ 70°C
• Dimension: 141.5mm(W) x 133.5mm(L) x 63mm(H)