Description
The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
| |
Application | Rating |
Thermal Conductivity | ***** |
Sub-Zero Overclocking | * |
Overclocking | **** |
Water Cooling | ***** |
Air Cooling | ***** |
Silicone Sensitive Areas | — |
within the capabilities of thermal pads Hardness Shore 00 - 65 |