Description
MANUFACTURER LINK : www.dynatron-corp.com
PRODUCT OVERVIEWS:
Intel Dual-Core Xeon Dempsey, Woodcrest & Clovertown, Socket771
For 1.5U Server
Passive Cooler
L- Fin Heatsink
Pitch: 1.7mm
Thickness of fin: 0.4mm
Number of fins: 45
Height of fin: 34mm
MANUFACTURER PARTS NUMBER: H43G
PRODUCT SPECIFICATION:
| CPU Socket | 771 | |
| CPU Support | Intel Dual-Core Xeon Dempsey, Woodcrest & Clovertown | |
| Solution | 1.5U | |
| Overall Dimension | 90.0 x 78.0 x 41.3 mm | |
| Weight | 860 g | |
| Material | Copper Heatsink with L Fin | |
| UPC: | 855700005127 |
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