Description
Product Overviews
B12 Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded for 2U server & up solution up to TDP 205 Watts heat dissipation
Product Specification
| CPU Support | Intel |
| CPU Socket | FCLGA3647 |
| Solution | 2U Server and Up |
| Material | Aluminum Heatsink, Copper Base with Heatpipes Embedded |
| Thermal Grease | Shin-Etsu 7762 Pre-Applied |
