TP-3 100 x 100 x 1.0 mm ACTPD00052A

The ARCTIC TP-3 Premium Performance Thermal Pad comes in a 100 x 100 x 1.0 mm size and includes one piece. Here are some key features of the product:

• Performance: The TP-3 is made of silicone and a special filler, which provides excellent thermal conductivity despite extremely low hardness. It is heat-conducting, vibration-damping, moldable, and electrically insulating, making it safe and easy to use.
• Compatibility: The TP-3 is versatile and can be used in a variety of applications, including graphics cards, motherboards, and other electronic components
• Durability: The TP-3 is built to demanding requirements for durability, shock tolerance, and long-term reliability
• Packaging: The product comes in a black color and includes one piece of thermal pad

The ARCTIC TP-3 is an excellent choice for those who need a reliable and high-performance thermal pad that is easy to use and provides excellent thermal conductivity. It is also an ideal solution for those who want to bridge unevenness for an even cooling surface. The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances.

HIGH PERFORMANCE — VERY SOFT

Based on silicone and a special filler, TP-3 outperforms high-performance pads, especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.

MINIMIZATION OF THERMAL RESISTANCE

The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care. Please refer to the user manual.

SAFE HANDLING

The ARCTIC TP-3 is electrically insulating, non-adhesive, and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.

BRIDGING GAPS

The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridge uneven surface and air gaps without stressing sensitive and protruding components.